MATERIALS:Master Bond EP30M3LV is a specially engineered, low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations. It also contains a special additive to remove air bubbles. This compound cures at room temperatures or more rapidly at elevated temperatures, and can be cured in various cross section thicknesses. EP30M3LV has a volume resistivity of 2×1015 ohm cm at 25C. It has a convenient 2:1 mix ratio by weight and an advantageously low mixed viscosity of 2,000-3,000 cps. It has a service operating temperature range of -60 to 250F. EP30M3LV also has superior dimensional stability, a flexural strength of 14,000 psi and a tensile strength of >8,000 psi. Master Bond EP30M3LV is environmentally friendly, 100 percent reactive and contains no solvents or diluents. It is available for use in half-pint, pint, quart, gallon and 5 gal pail kits.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.