MATERIALS:Master Bond EP30M3LV is a specially engineered, low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations. It also contains a special additive to remove air bubbles. This compound cures at room temperatures or more rapidly at elevated temperatures, and can be cured in various cross section thicknesses. EP30M3LV has a volume resistivity of 2×1015 ohm cm at 25C. It has a convenient 2:1 mix ratio by weight and an advantageously low mixed viscosity of 2,000-3,000 cps. It has a service operating temperature range of -60 to 250F. EP30M3LV also has superior dimensional stability, a flexural strength of 14,000 psi and a tensile strength of >8,000 psi. Master Bond EP30M3LV is environmentally friendly, 100 percent reactive and contains no solvents or diluents. It is available for use in half-pint, pint, quart, gallon and 5 gal pail kits.
The fun factor continues to draw developers to Linux. This open-source system continues to succeed in the market and in the hearts and minds of developers. Design News will delve into this territory with next week's Continuing Education Class titled, “Introduction to Linux Device Drivers.”
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.