MATERIALS:Interplex Industries, a leading global provider of precision components and assemblies, acquired Quantum Leap Packaging Inc. (QLP), a leading electronic packaging and polymer science company. Included in the transaction are all of QLP’s proprietary technologies including resin technologies such as QuantechTM semiconductor packaging. QuantechTM can be used to provide a lower cost and reliable air-cavity packaging solution compared to ceramic-based packages for the semiconductor packaging industry in applications such as high-power RF-Microwave assemblies, image sensors, HB-LEDs, MEMs and optical electronic systems. QLP’s innovative HermeTechTM package, based on QuantechTM technology, provides the semiconductor packaging industry’s first, true plastic hermetic package.
One way to keep a Formula One racing team moving at breakneck speed in the pit and at the test facility is to bring CAD drawings of the racing vehicleís parts down to the test facility and even out to the track.
Most of us would just as soon step on a cockroach rather than study it, but thatís just what researchers at UC Berkeley did in the pursuit of building small, nimble robots suitable for disaster-recovery and search-and-rescue missions.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies.
You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived.
So if you can't attend live, attend at your convenience.