MATERIALS:Interplex Industries, a leading global provider of precision components and assemblies, acquired Quantum Leap Packaging Inc. (QLP), a leading electronic packaging and polymer science company. Included in the transaction are all of QLP’s proprietary technologies including resin technologies such as QuantechTM semiconductor packaging. QuantechTM can be used to provide a lower cost and reliable air-cavity packaging solution compared to ceramic-based packages for the semiconductor packaging industry in applications such as high-power RF-Microwave assemblies, image sensors, HB-LEDs, MEMs and optical electronic systems. QLP’s innovative HermeTechTM package, based on QuantechTM technology, provides the semiconductor packaging industry’s first, true plastic hermetic package.
If a major catastrophe strikes your area, will you be prepared? Do you know how to modify the tech you've already got or MacGyver what you need to fit your own situation? A free, five-day Continuing Education Center course starting April 6 will show you how.
NanoSteel Co., which develops high-performance steel alloys, began producing steel powders for additive manufacturing (AM) last year and now supplies them commercially for freeform laser deposition and laser powder bed fusion processes.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.