MATERIALS:Interplex Industries, a leading global provider of precision components and assemblies, acquired Quantum Leap Packaging Inc. (QLP), a leading electronic packaging and polymer science company. Included in the transaction are all of QLP’s proprietary technologies including resin technologies such as QuantechTM semiconductor packaging. QuantechTM can be used to provide a lower cost and reliable air-cavity packaging solution compared to ceramic-based packages for the semiconductor packaging industry in applications such as high-power RF-Microwave assemblies, image sensors, HB-LEDs, MEMs and optical electronic systems. QLP’s innovative HermeTechTM package, based on QuantechTM technology, provides the semiconductor packaging industry’s first, true plastic hermetic package.
A group of researchers at the Seoul National University have discovered a way to take material from cigarette butts and turn it into a carbon-based material thats ideal for storing energy and creating a powerful supercapacitor.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.