MATERIALS:Interplex Industries, a leading global provider of precision components and assemblies, acquired Quantum Leap Packaging Inc. (QLP), a leading electronic packaging and polymer science company. Included in the transaction are all of QLP’s proprietary technologies including resin technologies such as QuantechTM semiconductor packaging. QuantechTM can be used to provide a lower cost and reliable air-cavity packaging solution compared to ceramic-based packages for the semiconductor packaging industry in applications such as high-power RF-Microwave assemblies, image sensors, HB-LEDs, MEMs and optical electronic systems. QLP’s innovative HermeTechTM package, based on QuantechTM technology, provides the semiconductor packaging industry’s first, true plastic hermetic package.
Unlike industrial robots, which suffered a slight overall slump in 2012, service robots continue to be increasingly in demand. The majority are used for defense, such as unmanned aerial vehicles (UAVs); and agriculture, such as milking robots.
Festo's BionicKangaroo combines pneumatic and electrical drive technology, plus very precise controls and condition monitoring. Like a real kangaroo, the BionicKangaroo robot harvests the kinetic energy of each takeoff and immediately uses it to power the next jump.
Design News and Digi-Key presents: Creating & Testing Your First RTOS Application Using MQX, a crash course that will look at defining a project, selecting a target processor, blocking code, defining tasks, completing code, and debugging.
These are the toys that inspired budding engineers to try out sublime designs, create miniature structures, and experiment with bizarre contraptions using sets that could be torn down and reconstructed over and over.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.