MATERIALS:Interplex Industries, a leading global provider of precision components and assemblies, acquired Quantum Leap Packaging Inc. (QLP), a leading electronic packaging and polymer science company. Included in the transaction are all of QLP’s proprietary technologies including resin technologies such as QuantechTM semiconductor packaging. QuantechTM can be used to provide a lower cost and reliable air-cavity packaging solution compared to ceramic-based packages for the semiconductor packaging industry in applications such as high-power RF-Microwave assemblies, image sensors, HB-LEDs, MEMs and optical electronic systems. QLP’s innovative HermeTechTM package, based on QuantechTM technology, provides the semiconductor packaging industry’s first, true plastic hermetic package.
A quick look into the merger of two powerhouse 3D printing OEMs and the new leader in rapid prototyping solutions, Stratasys. The industrial revolution is now led by 3D printing and engineers are given the opportunity to fully maximize their design capabilities, reduce their time-to-market and functionally test prototypes cheaper, faster and easier. Bruce Bradshaw, Director of Marketing in North America, will explore the large product offering and variety of materials that will help CAD designers articulate their product design with actual, physical prototypes. This broadcast will dive deep into technical information including application specific stories from real world customers and their experiences with 3D printing. 3D Printing is