MATERIALS:Solvay Advanced Polymers LLC’s AvaSpire® AV-700 Series is a new line of modified PEEK grades that fill the cost/performance gap between high-performance crystalline polymers (PPS, LCP and high-temperature nylon) and PEEK, an ultra-performance crystalline polymer. These proprietary PEEK-based formulations - available in unfilled, filled and wear-resistant grades - offer comparable strength and modulus, equivalent or better chemical resistance and up to a 30 percent cost reduction versus comparable PEEK grades. Targeted uses include applications in automotive, heavy-duty off-highway equipment, oil and gas recovery, semiconductors and chemical processing. The flagship material is AvaSpire® AV-722 BG 20, an unfilled resin that is the basis for most of the AV-700 series formulations. The line also consists of AvaSpire® AV-722 CF30, a 30 percent carbon fiber-reinforced grade, and three wear-resistant grades (AV-742 SL30, AV-722 SL30 and AV-755 SL45). Another grade, 40 percent glass-filled AvaSpire® AV-750 GF40, has been previously available.
When you think of the DARPA Robotics Challenge, you may imagine complex humanoid contraptions made of metal and wires that move like a Terminator Series T-90. But what actually happened at the much-vaunted event was something just a bit different.
Traditional dev kits are based on a manufacturer’s microcontroller, radio module, or sensor device. The idea is to aid the design engineer in developing his or her own IoT prototype as quickly as possible. A not-so-traditional IoT development kit released by Bosch aims to simplify IoT prototyping even further.
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