SENSORS: ifm efector inc.‘s new 3D Image Sensor measures size, shape and volume in industrial automation applications, and uses time-of-flight distance measurement and photonic mixer device technology to identify an object in the sensor‘s field of view. An integrated 64 x 48 pixel array defines the field of view for the sensor. The 3D sensor technology provides critical information in applications such as palletizing and de-palletizing, material handling, bulk level of materials and intelligent routing/sorting. The complete sensor element and electronics are built on a 0.25-mm square silicon chip, which enables 3-D imaging using Time of Flight, and reduces the size of the sensor and its cost. The solid-state metal housing measures 42 x 62 x 42 mm and is designed to withstand harsh environments and perform in fast-moving applications.
A group of researchers at the Seoul National University have discovered a way to take material from cigarette butts and turn it into a carbon-based material thats ideal for storing energy and creating a powerful supercapacitor.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.