SENSORS: ifm efector inc.‘s new 3D Image Sensor measures size, shape and volume in industrial automation applications, and uses time-of-flight distance measurement and photonic mixer device technology to identify an object in the sensor‘s field of view. An integrated 64 x 48 pixel array defines the field of view for the sensor. The 3D sensor technology provides critical information in applications such as palletizing and de-palletizing, material handling, bulk level of materials and intelligent routing/sorting. The complete sensor element and electronics are built on a 0.25-mm square silicon chip, which enables 3-D imaging using Time of Flight, and reduces the size of the sensor and its cost. The solid-state metal housing measures 42 x 62 x 42 mm and is designed to withstand harsh environments and perform in fast-moving applications.
Most cyber attacks could be avoided by adopting a list of Critical Security Controls that were created by the Center for Internet Security. That’s the message from Steve Mustard of the Automation Federation.
George Leopold's talk at last week's Design & Manufacturing Minneapolis helped restore astronaut and engineer Gus Grissom's role in the beginnings of NASA, and outlined how Grissom played a pivotal role in winning the Space Race.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies.
You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived.
So if you can't attend live, attend at your convenience.