SENSORS: ifm efector inc.‘s new 3D Image Sensor measures size, shape and volume in industrial automation applications, and uses time-of-flight distance measurement and photonic mixer device technology to identify an object in the sensor‘s field of view. An integrated 64 x 48 pixel array defines the field of view for the sensor. The 3D sensor technology provides critical information in applications such as palletizing and de-palletizing, material handling, bulk level of materials and intelligent routing/sorting. The complete sensor element and electronics are built on a 0.25-mm square silicon chip, which enables 3-D imaging using Time of Flight, and reduces the size of the sensor and its cost. The solid-state metal housing measures 42 x 62 x 42 mm and is designed to withstand harsh environments and perform in fast-moving applications.
The transformative nature of designing and making things was the overarching, common theme at separate conferences held in Boston by two giants in the PLM space: Autodesk, with its Accelerate 2015, and Siemens’s Industry Analyst Conference 2015.
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