SENSORS: ifm efector inc.‘s new 3D Image Sensor measures size, shape and volume in industrial automation applications, and uses time-of-flight distance measurement and photonic mixer device technology to identify an object in the sensor‘s field of view. An integrated 64 x 48 pixel array defines the field of view for the sensor. The 3D sensor technology provides critical information in applications such as palletizing and de-palletizing, material handling, bulk level of materials and intelligent routing/sorting. The complete sensor element and electronics are built on a 0.25-mm square silicon chip, which enables 3-D imaging using Time of Flight, and reduces the size of the sensor and its cost. The solid-state metal housing measures 42 x 62 x 42 mm and is designed to withstand harsh environments and perform in fast-moving applications.
It won't be too much longer and hardware design, as we used to know it, will be remembered alongside the slide rule and the Karnaugh map. You will need to move beyond those familiar bits and bytes into the new world of software centric design.
People who want to take advantage of solar energy in their homes no longer need to install a bolt-on solar-panel system atop their houses -- they can integrate solar-energy-harvesting shingles directing into an existing or new roof instead.
Kaspersky Labs indicated at its February meeting that cyber attacks are far more sophisticated than previous thought. It turns out even air-gapping (disconnecting computers from the Internet to protect against cyber intrusion) isn’t a foolproof way to avoid getting hacked. And Kaspersky implied the NSA is the smartest attacker.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.