SENSORS: ifm efector inc.‘s new 3D Image Sensor measures size, shape and volume in industrial automation applications, and uses time-of-flight distance measurement and photonic mixer device technology to identify an object in the sensor‘s field of view. An integrated 64 x 48 pixel array defines the field of view for the sensor. The 3D sensor technology provides critical information in applications such as palletizing and de-palletizing, material handling, bulk level of materials and intelligent routing/sorting. The complete sensor element and electronics are built on a 0.25-mm square silicon chip, which enables 3-D imaging using Time of Flight, and reduces the size of the sensor and its cost. The solid-state metal housing measures 42 x 62 x 42 mm and is designed to withstand harsh environments and perform in fast-moving applications.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Independent science safety company Underwriters Laboratories is providing new guidance for manufacturers about how to follow the latest IEC standards for implementing safety features in programmable logic controllers.
Automakers are adding greater digital capabilities to their design and engineering activities to promote collaboration among staff and suppliers, input consumer feedback, shorten product development cycles, and meet evolving end-use needs.
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