Bruce Wiebusch, Regional Editor --
Design News,
May 7, 2001
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Photonic Chips are wafer-based, integrated, optical sub-assemblies for high-volume telecommunication and data communications applications. They combine miniature optic and electronic components onto semiconductor wafer assemblies for use with optical fibers that have large voice, data, and video data-transfer capabilities. The manufacturer of high-performance optoelectronic devices that convert electrons to photons and back again relies mostly on manual assembly techniques. Digital Optics Corp. has developed a suite of manufacturing techniques that automate the making of optoelectronic modules. Passive components such as lenses and mirrors are fabricated on wafers using photolithography. Optical assemblies are built up through wafer-to-wafer bonding. Flip chip techniques are used for adding active components such as lasers and electronic elements. Initial applications for the technology include devices for short-range data communications and integrated sensor modules. Digital Optics Corp. works within an ISO 9001 infrastructure. Contact Digital Optics Corp., 5900 J. North Woods Business Pkwy., Charlotte, NC 28269; www.doc.com.
JUNE 26TH WEBCAST: Collaborative Requirements Engineering
Speed your innovation. Capture the "voice of the customer" and translate customer requests into user requirements that define new products. Find out why the new ENOVIA Requirements Management solution enables organizations to improve their overall global requirements management process. Read More
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Successful synergistic integration of controls, electronics, computers and mechanical systems is key to the 21st century design process. Unlock the secrets at the Mechatronics Zone!
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Engineering Concept Conduit
Engineering Concept Conduit looks at new products and the components that make them exceptional. Each month we’ll look at a new electronic product and see what makes it tick from an engineering point of view. We’ll explore the design and engineering challenges for the product and examine the components that solved those challenges.
Light Matters: Systems Level Approach to HBLED illumination applications
Its good practice to apply a systems-level approach to high-brightness LED (HBLED) illumination applications. Minimally, the system includes the optical, thermal and electrical characteristics of the of the HBLED, the lens (if any) which is built-in to its package, secondary optics such as external plastic lenses/reflectors to direct the light as your application requires and power driver electronics. Read More