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Kevin Russelburg -- Design News, July 11, 2001

Tuesday, September 14, 2000

Lisle, IL--Molex Inc. (www.molex.com) is now offering the Micro-Fit 3.0, an interconnect system designed to meet the need for a high contact density signal or power connector. The system incorporates many features previously found on larger power connectors. These 3.00-mm (0.118-inch) pitch connectors are for designs requiring compact connectors carrying up to 5A of current. Dual row test plugs are also available for continuity and are rated for 10,000 mating cycles.

Micro-Fit products are available in circuit sizes 2 to 24 for single and dual row, wire-to-board, and wire-to-wire applications. The product family has more than 500 part numbers, with many retention choices including fitting nails, solderable clips, and offset terminal retention. Additionally, the product line offers through-hole and SMT options. The latter are available in tape and reel packaging for robotic placement on the PCB.

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