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News Analysis
Content tagged with Materials & Assembly posted in May 2011
Powder Metal Parts Cut Costs
News 
5/20/2011  1 comment
2011 design winners are announced at PowderMet2011 conference in San Francisco.
Custom Implants Delivered in One Day
News 
5/19/2011  Post a comment
PEEK implants are machined and shipped quickly by startup medical manufacturing company.
Bioplastic Capacity Soars While Demand is Less Clear
News 
5/17/2011  Post a comment
European study predicts a doubling of capacity in five years.
Additive Manufacturing Strongly Bounces Back
News 
5/17/2011  Post a comment
Use of the technology is spreading widely, even to examination and reproduction of ancient skeletons.
New Technology Integrates Phone Antennas into Decorative Films
News 
5/10/2011  Post a comment
The number of antennas in mobile phones may mushroom to 16 as bandwidths explode.
New Bioplastic Features Higher HDT, Impact
News 
5/10/2011  Post a comment
Teknor Apex develops PLA compound that overcomes traditional inability to improve both thermal and impact properties.
New Solid Injection System Boosts Polyurethane Design
News 
5/10/2011  Post a comment
Novel method from Bayer MaterialScience enables the use of very light or heavy fillers, or also the combination of different types.
USCAR Announces New Fastening Technology
News 
5/2/2011  Post a comment
High-frequency sound waves determine the force needed to clamp two components together.




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Released on September 19, 2014, this 5.5 inch screen iPhone is the larger version of the iPhone 6, whose teardown follows tomorrow.
A Design News course on field programmable gate arrays (FPGAs) should help engineers who are considering the technology for their upcoming designs.
In many engineering workplaces, there’s a generational conflict between recent engineering graduates and older, more experienced engineers. However, a recent study published in the psychology journal Cognition suggests that both may have something to learn from another group: 4 year olds.
CTC releases EtherCAT Master module for high-performance control of networked servos, stepping motors, and I/O devices.
Conventional wisdom holds that MIT, Cal Tech, and Stanford are three of the country’s best undergraduate engineering schools. Unfortunately, when conventional wisdom visits the topic of best engineering schools, it too often leaves out some of the most distinguished programs that don’t happen to offer PhD-level degrees.
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