News Analysis
Content tagged with Electronics & Test posted in April 2011
Kit Introduces Designers to CPLDs
4/29/2011  Post a comment
Engineers and designers who need to investigate or use CPLDs and who can start without a stepwise tutorial might like this kit.
Design News Debuts New Product Showcase
4/27/2011  1 comment
A new home for up-to-the-minute product information and the latest news from companies in the design engineering industry.
Lighting Solution Simplifies LED Design
4/13/2011  Post a comment
System targets mechanical engineers who aren't yet familiar with the controls, optics and heat transfer issues associated with LED-based systems.
Apple Explores Metal-Ceramic Composites
4/12/2011  1 comment
Stronger, lighter materials are required as electronic devices shrink in size.
Twitter Helps Monitor Backup Power Sources in Japan
4/11/2011  Post a comment
A Twitter application built with LabVIEW and a USB DAQ device sends real-time results to help Japanese engineers manage their experiments amid rolling blackouts in the aftermath of the earthquake and tsunami.
Osram IPO Planned
4/6/2011  Post a comment
Siemens moves to publicly list Osram by fall 2011 to take advantage of the overall upswing in the lighting markets, and LEDs and green lighting in particular.
The TI-National Semi Deal:
4/5/2011  Post a comment
What Analysts Are Saying
TI to buy National Semi for $6.5 billion
4/5/2011  Post a comment
Deal remains subject to regulator review and approval of National's shareholders.

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Designers of electronic interfaces will need to be prepared to incorporate haptics in next generation products, an expert will tell attendees at the upcoming Designer of Things Conference in San Jose.
According to a Randstad Engineering compilation of salary studies, engineering salaries are increasing beyond inflation, with employers paying to keep potential suitors away from their employees.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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