IBM Aims Cloud at Design Engineering
News 7/28/2011 5 comments To accommodate the growing complexity of its POWER7 chip R&D project and to reduce costs, IBM created an HPC cloud offering tuned for engineering. Now the offering is available as a commercial product.
Putting a New Face on CAD Interoperability
News 7/10/2011 18 comments While working with multiple CAD systems still has its share of interoperability challenges, vendors have made strides leveraging new technologies and creating new workflows to facilitate cross-platform design.
P&G Offers Free Simulation Software to SMB Manufacturers
News 7/6/2011 5 comments As part of the broad Advanced Manufacturing Partnership announced by President Obama, P&G has promised to deliver free digital simulation software to small and midsized manufacturers to help foster innovation and spur product development efficiencies.
An in-depth survey of 700 current and future users of 3D printing holds few surprises, but results emphasize some major trends already in progress. Two standouts are the big growth in end-use parts and metal additive manufacturing (AM) most respondents expect.
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