IBM Aims Cloud at Design Engineering
News 7/28/2011 5 comments To accommodate the growing complexity of its POWER7 chip R&D project and to reduce costs, IBM created an HPC cloud offering tuned for engineering. Now the offering is available as a commercial product.
Putting a New Face on CAD Interoperability
News 7/10/2011 18 comments While working with multiple CAD systems still has its share of interoperability challenges, vendors have made strides leveraging new technologies and creating new workflows to facilitate cross-platform design.
P&G Offers Free Simulation Software to SMB Manufacturers
News 7/6/2011 5 comments As part of the broad Advanced Manufacturing Partnership announced by President Obama, P&G has promised to deliver free digital simulation software to small and midsized manufacturers to help foster innovation and spur product development efficiencies.
Altair has released an update of its HyperWorks computer-aided engineering simulation suite that includes new features focusing on four key areas of product design: performance optimization, lightweight design, lead-time reduction, and new technologies.
At IMTS last week, Stratasys introduced two new multi-materials PolyJet 3D printers, plus a new UV-resistant material for its FDM production 3D printers. They can be used in making jigs and fixtures, as well as prototypes and small runs of production parts.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
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