IBM Aims Cloud at Design Engineering
News 7/28/2011 5 comments To accommodate the growing complexity of its POWER7 chip R&D project and to reduce costs, IBM created an HPC cloud offering tuned for engineering. Now the offering is available as a commercial product.
Putting a New Face on CAD Interoperability
News 7/10/2011 18 comments While working with multiple CAD systems still has its share of interoperability challenges, vendors have made strides leveraging new technologies and creating new workflows to facilitate cross-platform design.
P&G Offers Free Simulation Software to SMB Manufacturers
News 7/6/2011 5 comments As part of the broad Advanced Manufacturing Partnership announced by President Obama, P&G has promised to deliver free digital simulation software to small and midsized manufacturers to help foster innovation and spur product development efficiencies.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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