IBM Aims Cloud at Design Engineering
News 7/28/2011 5 comments To accommodate the growing complexity of its POWER7 chip R&D project and to reduce costs, IBM created an HPC cloud offering tuned for engineering. Now the offering is available as a commercial product.
Putting a New Face on CAD Interoperability
News 7/10/2011 18 comments While working with multiple CAD systems still has its share of interoperability challenges, vendors have made strides leveraging new technologies and creating new workflows to facilitate cross-platform design.
P&G Offers Free Simulation Software to SMB Manufacturers
News 7/6/2011 5 comments As part of the broad Advanced Manufacturing Partnership announced by President Obama, P&G has promised to deliver free digital simulation software to small and midsized manufacturers to help foster innovation and spur product development efficiencies.
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