Content posted in July 2011
IBM Aims Cloud at Design Engineering
To accommodate the growing complexity of its POWER7 chip R&D project and to reduce costs, IBM created an HPC cloud offering tuned for engineering. Now the offering is available as a commercial product.
Solvay Pumps OLEDs
Global chemicals giant Solvay is making a $14.5 million investment in Plextronics in a push to to jumpstart development of printed electronics such as organic light-emitting diodes (OLEDs).
NHTSA Wants Hybrids & EVs to Be Louder
The National Highway Traffic Safety Administration (NHTSA) plans to propose regulations that would call on manufacturers of electric cars and hybrids to add special sounds to their vehicles to make them safer for pedestrians.
Putting a New Face on CAD Interoperability
While working with multiple CAD systems still has its share of interoperability challenges, vendors have made strides leveraging new technologies and creating new workflows to facilitate cross-platform design.
P&G Offers Free Simulation Software to SMB Manufacturers
As part of the broad Advanced Manufacturing Partnership announced by President Obama, P&G has promised to deliver free digital simulation software to small and midsized manufacturers to help foster innovation and spur product development efficiencies.