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News Analysis
Content posted in November 2006
CAD Translation Remains a Problem for Engineers
News 
11/20/2006  Post a comment
Survey shows little improvement for those using many design tools
Semiconductor Capacity Decline Will Have Impact
News 
11/20/2006  Post a comment
Drop foreseen in research and high-end engineering jobs
Lockheed, Toyota and Others Now Blending Technology, People
News 
11/20/2006  Post a comment
Companies focus on processes and culture to get the most from new technology
New Motion Control Assoc. Joins Industry
News 
11/20/2006  Post a comment
Group focuses on online tools, conferences and trade shows
Engineering Goes Global
News 
11/6/2006  Post a comment
Offshore outsourcing is growing rapidly, putting pressure on U.S. engineers
All-in-One Drive Module
News 
11/6/2006  Post a comment
Digital control, analog interface and power stage in a single package
Blow Molding PVDF
News 
11/6/2006  Post a comment
Kynar, a high-purity fluoropolymer, can be more easily transformed into hollow parts thanks to a blow-molding breakthrough
Improved, Not Cheaper
News 
11/6/2006  Post a comment
Better performance and cost savings at the system level
Wrap-Up
News 
11/6/2006  Post a comment
Regulations, standards, certifications drive trends
Changing Motorscape
News 
11/6/2006  Post a comment
Focusing on power density, motion control solutions
Automation Vendors Gather at Assembly Tech
News 
11/6/2006  Post a comment
More than 600 exhibitors present new automation technology
Drives Are Smarter
News 
11/6/2006  Post a comment
Intelligent drives provide distributed processing in unique product designs
Seven ICs in One Chip
News 
11/6/2006  Post a comment
Energy measuring chip brings more LCD meters to residential market
Using the Power
News 
11/6/2006  Post a comment
Controllers focus on using highly integrated solutions
Industrial Motion Control Sensors
News 
11/6/2006  Post a comment
Solving difficult problems with ease
Add Functionality, Reduce Waste
News 
11/6/2006  Post a comment
Fluid power defines its role in the system




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A team from MIT's Computer Science and Artificial Intelligence Lab (CSAIL) has developed a breakthrough new multi-material 3D printer.
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