Continuing Education Center
Content posted in July 2012
Part V: Circuit Boards & Systems
Continuing Education Center 7/27/2012
Electronic components like integrated circuits are incredibly useful - but not when they're in isolation. The unsung hero of the electronics system world is the circuit board, which connects everything together. In this session, we will discover the origin of printed circuit board technology; single-sided, double-sided, and multi-layer circuit boards; and flexible circuit technologies. We will also consider electronic systems in general, leading to concepts like "The Internet of Things."
Part IV: Programmable Devices
Continuing Education Center 7/26/2012
In this session, we consider the earliest forms of programmable logic devices (PLDs), including PROMs, PLAs, PALs, and GALs, many of which are still in use to this day. Next we consider the evolution from simple PLDs (SPLDs) to complex PLDs (CPLDs). Also, we consider the problems with ASICs/SoCs and the gap between SPLDs/CPLDs and ASICs/SoCs that led to the introduction of FPGAs. In addition to discussing FPGAs in some detail, we consider the various programming technologies that may be used.
Part III: Chips & Packages
Continuing Education Center 7/25/2012
In this session, we discover different types of ICs, including analog, digital, mixed-signal, and radio frequency (RF). We will also introduce the concepts of microprocessors (MPUs), microcontrollers (MCUs), programmable devices (SPLDs, CPLDs, and FPGAs), and ASICs/ASSPs/SoCs. Different forms of memory (SRAM, DRAM, EEPROM, Flash, FRAM, MRAM, and PCM) will be introduced. Also discussed will be different forms of packaging, including System-in-Package (SiP) assemblies and 3D IC technologies.
Part II: Analog vs. Digital
Continuing Education Center 7/24/2012
In this session, we will discover the difference between the analog and digital domains; the wide variety of analog sensor technologies that are available; the ways in which we can implement multi-value digital systems; the ways we sample analog values and convert them into their digital counterparts; the difference between analog signal processing (ASP) and digital signal processing (DSP), and much, much more...
Part I: Fundamental Concepts
Continuing Education Center 7/23/2012
We introduce fundamental concepts, starting with protons, neutrons, and electrons, leading to molecules, crystals, etc., which leads to the difference between conductors and insulators. We consider voltage and current, resistance and resistors, capacitance and capacitors, and inductance and inductors. Next, we look at different ways to control electricity, from switches to relays to vacuum tubes to diodes and transistors. Finally, we see primitive logic functions like NOT, AND, and OR gates.
Part V: Deployment Test
Continuing Education Center 7/13/2012
This lecture will provide practical guidance on deployment testing in the field. We will discuss test methods, test equipment, and strategies for obtaining valid test results under variable field conditions and in the presence of interference. In addition, we will wrap up any loose ends from the previous days’ lectures and answer any remaining questions.
Part IV: Production Test
Continuing Education Center 7/12/2012
This lecture will cover the challenges associated with production testing of wireless hardware. We will discuss strategies for optimizing test speed, maximizing yields, and minimizing false failures. We will also examine test fixturing for over-the-air coupling to a wireless device under test (DUT).
Part III: Quality Assurance Test
Continuing Education Center 7/11/2012
This lecture will examine QA test and test automation techniques. We will cover common test scripting and regression test methods and will discuss ways of reproducing field conditions and field failures.
Part II: R&D Test
Continuing Education Center 7/10/2012
Today's lecture will cover R&D test methods and metrics applicable to wireless products. We will learn about performance and certification testing of RF and protocol layers. The material will include test methods for measuring radio range, data rate adaptation, roaming performance, throughput, and system level functionality.
Introduction: Testing Wireless Devices & Systems
Continuing Education Center 7/9/2012
In this session, you will learn about wireless test methods, test standards, and test equipment used in R&D, quality assurance (QA), and production. We will cover performance, interoperability certification, and regression testing of mainstream wireless devices and systems, including WiFi, LTE, and other technologies. We will discuss hardware and software test methods and review test and certification standards from organizations including IEEE, IETF, 3GPP, PTCRB, and GCF.
2016 engineering grads can expect to earn an average salary of $65,000 right out of the gate. Petroleum engineers' wallets are much fatter, though -- they are expected to earn about $20K more.
3D printing is now adding value to manufacturers at all steps along the business value chain. Come find out how at a talk by John Jaddou at next month's Embedded Systems Conference in Minneapolis.
From IoT and M2M to flexible robotics and consumer HMI, the advances in smart manufacturing are being deployed on the packaging floor.
These new 3D-printing technologies and printers include some that are truly boundary-breaking: a sophisticated new sub-$10,000, 10-plus materials bioprinter, the first industrial-strength silicone 3D-printing service, and a clever twist on 3D printing and thermoforming for making high-quality realistic models.
Ear-based heart-rate monitoring gained momentum recently, as sensor maker Valencell Inc. announced it has licensed its biometric earpiece technology to Samsung Electronics Co. Ltd for use in so-called “hearable devices.”
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies.
You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived.
So if you can't attend live, attend at your convenience.