Part V: Circuit Boards & Systems
Continuing Education Center 7/27/2012 397 comments Electronic components like integrated circuits are incredibly useful - but not when they're in isolation. The unsung hero of the electronics system world is the circuit board, which connects everything together. In this session, we will discover the origin of printed circuit board technology; single-sided, double-sided, and multi-layer circuit boards; and flexible circuit technologies. We will also consider electronic systems in general, leading to concepts like "The Internet of Things."
Part IV: Programmable Devices
Continuing Education Center 7/26/2012 412 comments In this session, we consider the earliest forms of programmable logic devices (PLDs), including PROMs, PLAs, PALs, and GALs, many of which are still in use to this day. Next we consider the evolution from simple PLDs (SPLDs) to complex PLDs (CPLDs). Also, we consider the problems with ASICs/SoCs and the gap between SPLDs/CPLDs and ASICs/SoCs that led to the introduction of FPGAs. In addition to discussing FPGAs in some detail, we consider the various programming technologies that may be used.
Part III: Chips & Packages
Continuing Education Center 7/25/2012 471 comments In this session, we discover different types of ICs, including analog, digital, mixed-signal, and radio frequency (RF). We will also introduce the concepts of microprocessors (MPUs), microcontrollers (MCUs), programmable devices (SPLDs, CPLDs, and FPGAs), and ASICs/ASSPs/SoCs. Different forms of memory (SRAM, DRAM, EEPROM, Flash, FRAM, MRAM, and PCM) will be introduced. Also discussed will be different forms of packaging, including System-in-Package (SiP) assemblies and 3D IC technologies.
Part II: Analog vs. Digital
Continuing Education Center 7/24/2012 562 comments In this session, we will discover the difference between the analog and digital domains; the wide variety of analog sensor technologies that are available; the ways in which we can implement multi-value digital systems; the ways we sample analog values and convert them into their digital counterparts; the difference between analog signal processing (ASP) and digital signal processing (DSP), and much, much more...
Part I: Fundamental Concepts
Continuing Education Center 7/23/2012 602 comments We introduce fundamental concepts, starting with protons, neutrons, and electrons, leading to molecules, crystals, etc., which leads to the difference between conductors and insulators. We consider voltage and current, resistance and resistors, capacitance and capacitors, and inductance and inductors. Next, we look at different ways to control electricity, from switches to relays to vacuum tubes to diodes and transistors. Finally, we see primitive logic functions like NOT, AND, and OR gates.
Part V: Deployment Test
Continuing Education Center 7/13/2012 250 comments This lecture will provide practical guidance on deployment testing in the field. We will discuss test methods, test equipment, and strategies for obtaining valid test results under variable field conditions and in the presence of interference. In addition, we will wrap up any loose ends from the previous days’ lectures and answer any remaining questions.
Part IV: Production Test
Continuing Education Center 7/12/2012 321 comments This lecture will cover the challenges associated with production testing of wireless hardware. We will discuss strategies for optimizing test speed, maximizing yields, and minimizing false failures. We will also examine test fixturing for over-the-air coupling to a wireless device under test (DUT).
Part III: Quality Assurance Test
Continuing Education Center 7/11/2012 345 comments This lecture will examine QA test and test automation techniques. We will cover common test scripting and regression test methods and will discuss ways of reproducing field conditions and field failures.
Part II: R&D Test
Continuing Education Center 7/10/2012 404 comments Today's lecture will cover R&D test methods and metrics applicable to wireless products. We will learn about performance and certification testing of RF and protocol layers. The material will include test methods for measuring radio range, data rate adaptation, roaming performance, throughput, and system level functionality.
Introduction: Testing Wireless Devices & Systems
Continuing Education Center 7/9/2012 405 comments In this session, you will learn about wireless test methods, test standards, and test equipment used in R&D, quality assurance (QA), and production. We will cover performance, interoperability certification, and regression testing of mainstream wireless devices and systems, including WiFi, LTE, and other technologies. We will discuss hardware and software test methods and review test and certification standards from organizations including IEEE, IETF, 3GPP, PTCRB, and GCF.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.