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Content tagged with Materials & Assembly posted in July 2007
Boeing Joins with Russia's VSMPO-Avisma to Meet Titanium Demands for 787 Dreamliner
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7/30/2007  Post a comment
Boeing's capacity to produce composites must double to meet projected demand for the 787 Dreamliner over the next five years
Exclusive: Engineer Shot Down Faulty Big Dig Epoxy in 1999
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7/30/2007  Post a comment
A Massachusetts highway engineer denied approval to the fast-setting epoxy material used in Boston's Big Dig
Jergens Releases New Line of Thread Repair Inserts
Features 
7/27/2007  Post a comment
Inserts meet MS and NAS standards
Big Dig Concrete Supplier Aggregate to Pay $42 Million
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7/27/2007  Post a comment
Agrees to pay to settle civil and criminal investigations against the company
2007 Reader's Choice Awards
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7/25/2007  Post a comment
Which products do you think deserve Design News' esteemed "Best Consumer Product" award?
How to Select the Proper Latch for Any Designed Enclosure
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7/16/2007  Post a comment
Consider access hardware early in the design process to avoid costly problems
Big Dig Tunnel Ceiling Collapse Could Have Been Avoided
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7/10/2007  Post a comment
Routine inspections could have prevented death in Big Dig project
Bayer May Further Delay Chinese Polycarbonate Project
Features 
7/3/2007  Post a comment
Shortage of components and labor in busy Shanghai add to the woes




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(Video) NASA's Modular Robotic Vehicle (MRV) is an EV inspired by manned rovers used for space exploration.
Comedian John Oliver recently did a segment on patent trolls, offering a hiliarious take on a serious issue plaguing US industries.
United Launch Alliance will fly 3D-printed flight hardeware parts on its rockets starting next year with the Atlas V. The company's Vulcan next-gen launch vehicle will have more than 100 production parts made with 3D printing. The main driver? Parts consolidation and 57% lower production costs.
The new small-form-factor EZ-BLE PRoC (Programmable Radio on Chip) module is a derivative of the existing PRoC BLE Programmable Radio-on-Chip solution. The EZ-BLE PRoC module integrates the programmability and ARM Cortex-M0 core of the PRoC BLE, two crystals, an onboard chip antenna, a metal shield, and passive components.
The engineers and inventors of the post WWII period turned their attention to advancements in electronics, communication, and entertainment. Breakthrough inventions range from LEGOs and computer gaming to the integrated circuit and Ethernet -- a range of advancements that have little in common except they changed our lives.
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