Content tagged with Electronics & Test posted in June 2007
Wireless Conference Calls
6/25/2007  Post a comment
Revolabs works to rid meetings of distracting background noise
Cognex Releases New Sensors
6/11/2007  Post a comment
Checker 200 inspection and In-Sight 5600 vision series
Freescale, Fujitsu, Renesas Roll Out Graphics Processors
6/7/2007  Post a comment
New SoCs meet future needs of automotive instrument clusters
Schurter Releases High-Current Appliance Inlets
6/5/2007  Post a comment
New 1601 series with PCB mounting
Crane Announces New Switch Matrices
6/4/2007  Post a comment
New 1120 and 1130 switch matrices have 144 inputs and outputs
The Challenge of Shrinking Semiconductor Structures
6/4/2007  Post a comment
Motion control improvements provide part of the solution
Boeing's 'More Electric' 787 Dreamliner Spurs Engine Evolution
6/4/2007  Post a comment
On the 787, Boeing eliminated bleed air and relied heavily on electric starter generators
Alliances for Semiconductor Manufacturing
6/4/2007  Post a comment
Semiconductor manufacturers gang up to take on processing challenges
Control Systems Improve Semiconductor Manufacturing
6/4/2007  Post a comment
Process control relies on motion and more
Improving Analog Circuits
6/4/2007  Post a comment
A solution to heavy analog circuit power consumption
Boeing 787 Dreamliner Rolls Out Smoother Ride with Gust Suppression
6/4/2007  Post a comment
Dreamliner’s gust suppression system senses pressure differences before inertial motion begins

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Designers of electronic interfaces will need to be prepared to incorporate haptics in next generation products, an expert will tell attendees at the upcoming Designer of Things Conference in San Jose.
According to a Randstad Engineering compilation of salary studies, engineering salaries are increasing beyond inflation, with employers paying to keep potential suitors away from their employees.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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