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Features
Content posted in October 2006
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Passives Move in Many Directions
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Size, power, heat specifications all improve
Technology Inside: Understanding the Process
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The enclosure usually conveys the design intent of the end product
I/O Expands into Motion
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Devices add capabilities for controlling stepper, servo and dc motors
Bonding Yields Better Parts
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Materials improve reliability, help cool chips
Record Killer Data
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Workhorses Continue to Evolve
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Capacitors shrink while boosting performance, broaden capabilities
Software Provides Speedy Development Tools
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RTOS vendors focus on time-to-market
Distributors Enhance Support Options
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Design services extend to engineering community
DC-to-DC Converters
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Voltage levels proliferate, need for efficiency increases inside the box
Unique Requirements Met
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Call these connectors what you will, they fulfill a critical need
Connectors at Work
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Special connector/cable designs withstand the daily rigors of a factory environment
Toolmakers Focus on Ease-of-Use
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Design tools simplify data sharing
'Weight' A Minute
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Gyros Progress
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MEMS-based products target emerging applications
LEDs Continue to Shed More Light
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High output opens new applications
IC Makers Roll Out New Power Management Device
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Packs more functionality into chips
Cool It
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New cooling techniques offer unique solutions to remove heat
Communications are Reaching into Homes, Cars
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Transceivers trim price, size
USB Links Instruments to Many Technologies
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Fast link provides ease-of-use
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