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Content posted in October 2007
iSensor Gyroscope Takes the Worry out of Torque Checks
News 
10/22/2007  Post a comment
Integration of an innovative sensor boosts reliability in measuring rotational change in industrial fasteners
NI Unveils Software Platform for Multicore Applications
News 
10/22/2007  Post a comment
Automatic multithreading could make it easier for engineers to deal with embedded dual-core and quad-core architectures
Customers Drive Fall 2007 Release of Arena PLM
News 
10/22/2007  Post a comment
Upgrade is stocked with more than 70 customer-driven features that touch all functional areas of the product
The Virtual Future of Distribution
News 
10/8/2007  Post a comment
Engineers get what they need at enhanced distributor websites
Sensing in Consumer and Industrial Systems
News 
10/8/2007  Post a comment
Innovative and integrated characterize new sensors
SGI Blade Server Goes Green
News 
10/8/2007  Post a comment
Four-coil heat exchanger cuts electrical consumption
Analog IC Gets Smaller, More Complex and Energy Efficient
News 
10/8/2007  Post a comment
Changing applications force innovation on analog IC
Lithium Technology Meets Challenge of Greater Efficiency in Smaller Package
News 
10/8/2007  Post a comment
Higher efficiency, smaller form factors and energy alternatives provide growth
MISUMI's New Source for Off-the-Shelf Linear Actuators
News 
10/8/2007  Post a comment
MISUMI has introduced a standard line of ball-screw-driven actuators for use in general automation applications
Connectors, Cables Must Follow Electronic Product Trends
News 
10/8/2007  Post a comment
Connector industry grows by following electronic product trends
Multiple Trends Pressure Change in DSPs
News 
10/8/2007  Post a comment
Complexity, size and energy efficiency drive innovation
Electromechanical Components Use Electronics to Satisfy System Requirements
News 
10/8/2007  Post a comment
Electromechanical components complete electronic systems
The Future Will See Ever-Increasing Complexity
News 
10/8/2007  Post a comment
Software takes a big role in managing complex data
Gore-Tex Cools WiMAX Base Stations
News 
10/8/2007  Post a comment
Thermal management systems are based on Gore-Tex materials technology coupled with ebm-papst fans
Autodesk Takes Flight with FEA Functionality
News 
10/8/2007  1 comment
PlassoTech technology enhances firm’s digital prototyping story, providing FEA capabilities for both parts and entire assemblies
Application Trends Drive Changes in Passive Components
News 
10/8/2007  Post a comment
Passives suppliers strive for high performance with low energy consumption




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Adam Berger hacked a computer keyboard into a mini key-tar to play with his band.
Altair has released an update of its HyperWorks computer-aided engineering simulation suite that includes new features focusing on four key areas of product design: performance optimization, lightweight design, lead-time reduction, and new technologies.
At IMTS last week, Stratasys introduced two new multi-materials PolyJet 3D printers, plus a new UV-resistant material for its FDM production 3D printers. They can be used in making jigs and fixtures, as well as prototypes and small runs of production parts.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
If you're planning to develop a product that uses a microcontroller, you'll want to take note of next week's Design News Continuing Education course, "MCU Software Development – A Step-by-Step Guide."
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