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Guest Blogs
Content posted in October 2011
Customized Coke Machine: Not the Free Choice I Want
Guest Blogs 
10/20/2011  22 comments
The new Coca-Cola Freestyle self-serve soda fountain is advanced technology but perhaps too much of a good thing.
Slideshow: Apple iPhone 4S Teardown
Guest Blogs 
10/18/2011  7 comments
UBM TechInsights conducted a teardown of the iPhone 4S and found use of communications silicon and processors from Apple, Qualcomm, Triquint, Samsung, Skyworks, and Elpida.
The Slow Ramp to PLM's Value
Guest Blogs 
10/7/2011  7 comments
While PLM has major potential to improve product development processes, the process improvement and people issues associated with the technology tend to turn deployments into multi-year engagements.
'Trusted' Security Effort Could Protect Factory, Embedded Networks
Guest Blogs 
10/6/2011  5 comments
Security in the factory and automation sectors could get a big boost if a new industry working group succeeds in creating authentication and data security standards for the embedded arena.
Stealth Material Cloaks Military Vehicles
Guest Blogs 
10/4/2011  16 comments
Infrared-camoflauging tiles developed by engineers at BAE Systems in Sweden can alter military vehicles' infrared (IR) signatures so that troop carriers could appear to be passenger cars or even blend into the background.




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Futurist Raymond Kurzweil discussed biotechnology, solar power, and 3D printing at the Pacific Design & Manufacturing Show in Anaheim this week.
Valentine’s Day seems like a good time to recognize those folks around us who have had a hand in our success.
Makers of industrial PCs are continuing to take advantage of Moore’s law expansion of processing power enabling creative automation and control schemes with multicore processors.
Researchers at Lawrence Livermore National Laboratory have published two physics-based models for the selective laser melting (SLM) metals additive manufacturing process, so engineers can understand how it works at the powder and scales, and develop better parts with less trial and error.
The designer can now analyze temperature distribution in a design, tracking input and output of heat loads, and also turn it into a thermal stress study.
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