Slideshow: Making Sense of Connected Sensors
Blog 11/26/2012 11 comments The Embedded Technology 2012 trade show held recently in Yokohama, Japan, focused on five smart technologies: energy, healthcare, agriculture, automotive, and transportation systems, as well as mobile and cloud computing.
Autodesk Enters the Gaming Industry
CAD/CAM Corner 11/15/2012 3 comments Autodesk provides easy-to-use tools for every technical industry. Now, with its new version of Scaleform for mobile game developers, the gaming industry is in their sights.
Teamcenter PLM Meets Up With the Cloud
CAD/CAM Corner 11/5/2012 3 comments As part its "future-proof architecture" tenet, Siemens PLM Software is now offering a cloud-based delivery option for Teamcenter via three leading infrastructure-as-a-service (IaaS) providers.
Altair has released an update of its HyperWorks computer-aided engineering simulation suite that includes new features focusing on four key areas of product design: performance optimization, lightweight design, lead-time reduction, and new technologies.
At IMTS last week, Stratasys introduced two new multi-materials PolyJet 3D printers, plus a new UV-resistant material for its FDM production 3D printers. They can be used in making jigs and fixtures, as well as prototypes and small runs of production parts.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
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