Tiny Camera Sees Nonvisible Spectra
Engineering Materials 3/16/2012 14 comments A camera chip combining hyperspectral sensing with a machine-vision-grade image sensor will help incorporate spectroscopy into industrial vision applications.
Case of the Skewed Chips
Sherlock Ohms 3/6/2012 13 comments The automation was working within specs for chip placement, but it wasn't working as well as it should. A step-by-step look revealed the flaw.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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