Siemens Issues SIMATIC Security Advisory
Wolfe's Den 7/7/2011 6 comments Siemens has issued a warning about a potential hacker entry point in its SIMATIC S7 family of programmable logic controllers, along with recommendations for protective security measures.
New Debugger Complements Atmel AVR Studio 5
Mechatronics Zone 7/7/2011 2 comments Atmel now has a new in-circuit debugger and programmer module, the JTAGICE3, which operates with the AVR Studio 5 software and all Atmel 8-bit and 32-bit AVR-family microcontrollers (MCUs).
Dassault Pushes 3D Printing for the Masses
CAD/CAM Corner 7/6/2011 14 comments Amidst a flurry of activity on the 3D printing front, Dassault Systèmes partners with the Sculpteo 3D printing service to give 3DVIA users a way to easily produce 3D physical models of their 3D digital creations.
Autodesk Expands Eco Materials Adviser
CAD/CAM Corner 7/6/2011 2 comments With sustainable design becoming a more important requirement for engineers, Autodesk is making the full version of Granta's Eco Materials Adviser available to help achieve a more well rounded sustainability profile.
Join the Maker Revolution
Guest Blogs 7/6/2011 3 comments Guest blogger Todd Grimm is buying a kit to make a 3-D printer, and will share his experiences with readers interested in this red hot trend.
Moore's Law Struggling to Keep Up
Electronics News 7/1/2011 6 comments Multicore solutions will be critical in the next five years to overcome the Moore's Law obstacle, and technical challenges need to be addressed on both sides of the Internet.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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